16. 紫外光刻胶能达到怎样的分辨率和对比度?
16. Which resolution and which contrast can be obtained with photoresists?
The resolution of resists is influenced by several parameter such as e.g. the type of mask liner used, most of the respective NA (numerical aperture), film thickness, exposure wavelength, concentration of
developer and time of development, substrate (e.g. reflexion properties), and a few other parameters with minor influence on the result. The following table lists approximate values as determined in own tests under standard assay conditions or the best results of our users with a particular resist. To determine the contrast, the development process was optimised for the respective needs (longer development time and a lower developer concentration):
Photoresist
|
Film thickness (μm)
|
Resolution (μm)
|
Contrast
|
AR-P 1250
|
6
|
2
|
2
|
AR-P 3100
|
0.6
|
0.5
|
4
|
AR-P 3200
|
20
|
5
|
2
|
AR-P 3200
|
50
|
15
|
1.6
|
AR-P 3500 (T)
|
2
|
1.2
|
4.5
|
AR-P 3740, 3840
|
1.4
|
0.4
|
6
|
AR-U 4000
|
1
|
0.6
|
3.5
|
AR-N 4240
|
1.4
|
0.8
|
2.8
|
AR-N 4340
|
2
|
1
|
5
|
AR-N 4400
|
10
|
1.2
|
3
|
AR-N 4400
|
55
|
3
|
2
|
AR-P 5300
|
1
|
0.5
|
5
|
AR-P 5400/3510
|
at least threefold film thickness of the bottom layer AR-P 5400
|