7. How can e-beam resist films be removed again?
For the removal of all e-beam resist coatings baked at lower temperatures (softbake), polar solvents may be used such as e.g. the recommended thinner AR 300-12 or AR 600-01, 600-07, and 600-09, as well as remover AR 600-70 (acetone-based). AR 600-70 is the most commonly used remover for this purpose.
For the wet-chemical removal of PMMA coatings baked up to 190 °C, the highly versatile organic remover AR 600-70 is recommended, as well as AR 300-70 and AR 300-72. Remover AR 300-70 and AR 300-72 do not attack aluminium and may be heated to 80 °C to reduce the time for removal. The
For the wet-chemical removal of baked novolak coatings (AR-P/N 7000) up to 150 °C, the highly versatile organic remover AR 300-70 and AR 300-72 are recommended, which are also employed after moderate plasma etchings. For layers baked at even higher temperatures, only ultrasound treatment (for
In semiconductor industry, removal (stripping) is mostly carried out by ashing in a plasma asher.
Microwave excitation generates an O2-plasma which in most cases reliably removes all PMMA-layers.